Robust Power Semiconductor Systems 2 - Lecture

General Information

Important Information
The lecture conveys a solid understanding of the use of modern semiconductor technologies in power electronic applications. Based on the relevant figures of merit of Si, GaN and SiC based power semiconductors, aspects of circuit design, mounting and packaging and reliability will be covered.

Die Vorlesung vermittelt ein fundiertes Verständnis für den Einsatz moderner Halbleitertechnologien in leistungselektronischen Anwendungen. Ausgehend von den wichtigsten Kenngrößen von Leistungstransistoren auf Si, GaN und SiC Basis werden Aspekte u. a. der Schaltungstechnik, Aufbau- und Verbindungstechnik und Zuverlässigkeit diskutiert.
Syllabus
Part 5: Thermal Analysis
Motivation - Thermal Material Properties - Electro-thermal - Thermo-mechanical entities - Thermal Modeling - Thermal Equivalent Circuits - Thermal FEM Simulation

Part 6: Reliability and Lifetime
Reliability and Lifetime - Reliability Functions - Accelerated Lifetime Tests - Failure Rate Models - Reliability Tests - Failure Mechanisms - Semiconductor Device Level - Package Level

Part 7: GaN-Based Power Transistors
Material Properties - Device Fabrication - Device Performance

General

Language
German
Copyright
All rights reserved

Contact

Name
Ingmar Kallfass
Responsibility
Dozent
Telephone
68568747
E-Mail
ingmar.kallfass@ilh.uni-stuttgart.de

Support Contacts

[IngmarKallfass]

Availability

Access
12. Feb 2024, 00:00 - 31. Mar 2025, 00:00
Admittance
You have to request for membership to access this course. Please describe your interest for becoming member in the message form. You will be notified as soon as an administrator has accepted or declined your request.
Registration Period
Unlimited
Period of Event
11. Apr 2023 - 23. Jul 2023

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Additional Information

Object-ID
4625953